Material Introduction
Multi-layer Composite Material CMC/CPC
Material Introduction
Copper-molybdenum-copper (CMC) and copper-molybdenum-copper-copper (CPC) are composite materials with a laminated structure. The core material of CMC is molybdenum, while that of CPC is molybdenum copper. Usually, the default material is Mo70Cu30, with both sides covered with copper. Such materials usually consist of three layers, though can also be five or more layers. The single-layer thickness should be uniform, with firm interlayer bonding, in order to make the most of the typical copper characteristics of high thermal conductivity, combined with the low thermal expansion of molybdenum. The material is widely used as a microelectronic packaging material in electronic power and other industries.
We produce CMC and CPC materials to any proportion, adjusting the thermal conductivity and thermal expansion coefficient by adjusting the relative thickness of each layer, as well as the molybdenum-copper composition of the core materials, to obtain the required performance.
Specifications and Performance
Typical properties of multi-layer composite materials
|
Grade |
Core material |
Proportion of each layer |
Thermal expansion coefficient |
Thermal conductivity |
|
Room temperature～800 ℃ |
Room temperature/W(m·K)-1 |
|||
|
CMC111 |
Mo |
1:1:1 |
≤10.4 |
≥190 |
|
CMC121 |
Mo |
1:2:1 |
≤9.5 |
≥177 |
|
CMC131 |
Mo |
1:3:1 |
≤8.8 |
≥169 |
|
CMC141 |
Mo |
1:4:1 |
≤8.1 |
≥160 |
|
CMC31313 |
Mo |
3:1:3:1:3 |
≤10.0 |
≥270 |
|
CMC51515 |
Mo |
5:1:5:1:5 |
≤11.9 |
≥283 |
|
CPC111 |
Mo70Cu30 |
1:1:1 |
≤11.6 |
≥258 |
|
CPC232 |
Mo70Cu30 |
2:3:2 |
≤10.9 |
≥242 |
|
CPC121 |
Mo70Cu30 |
1:2:1 |
≤10.5 |
≥226 |
|
CPC131 |
Mo70Cu30 |
1:3:1 |
≤9.6 |
≥210 |
|
CPC141 |
Mo70Cu30 |
1:4:1 |
≤9.1 |
≥197 |
Fabrication Process
Advantage
The multilayer composite material CMC/CPC has excellent initial heat dissipation properties on its surface since both surfaces are made of copper. As a form of electronic packaging material, it shows a better heat dissipation effect than molybdenum-copper alloys. It has thus become the preferred heat sink packaging material for a new generation of high-power electrical appliances, and has broad application prospects.
Address:Area C, AT&M, No. 10 North Yongcheng Road, Yongfeng Industrial Base, Haidian District, Beijing, China / No. 10 Baozhong Road, Baodi Economic and Development Zone, Tianjin, China
Tel: +86 (0)10 5871-7301 / +86 (0)22 5921-3388
International Trade: +86 18892203868 / anne@attl.cn
Scan and Subscribe to Learn More
ATTL Advanced Materials Co.,Ltd.