Material Introduction

Multi-layer Composite Material CMC/CPC

Material Introduction


Copper-molybdenum-copper (CMC) and copper-molybdenum-copper-copper (CPC) are composite materials with a laminated structure. The core material of CMC is molybdenum, while that of CPC is molybdenum copper. Usually, the default material is Mo70Cu30, with both sides covered with copper. Such materials usually consist of three layers, though can also be five or more layers. The single-layer thickness should be uniform, with firm interlayer bonding, in order to make the most of the typical copper characteristics of high thermal conductivity, combined with the low thermal expansion of molybdenum. The material is widely used as a microelectronic packaging material in electronic power and other industries.

We produce CMC and CPC materials to any proportion, adjusting the thermal conductivity and thermal expansion coefficient by adjusting the relative thickness of each layer, as well as the molybdenum-copper composition of the core materials, to obtain the required performance.

Specifications and Performance


Typical properties of multi-layer composite materials

Grade

Core material

Proportion of each layer

Thermal expansion coefficient

Thermal conductivity

Room temperature~800 ℃
×10-6/K-1

Room temperature/W(m·K)-1

CMC111

Mo

1:1:1

≤10.4

≥190

CMC121

Mo

1:2:1

≤9.5

≥177

CMC131

Mo

1:3:1

≤8.8

≥169

CMC141

Mo

1:4:1

≤8.1

≥160

CMC31313

Mo

3:1:3:1:3

≤10.0

≥270

CMC51515

Mo

5:1:5:1:5

≤11.9

≥283

CPC111

Mo70Cu30

1:1:1

≤11.6

≥258

CPC232

Mo70Cu30

2:3:2

≤10.9

≥242

CPC121

Mo70Cu30

1:2:1

≤10.5

≥226

CPC131

Mo70Cu30

1:3:1

≤9.6

≥210

CPC141

Mo70Cu30

1:4:1

≤9.1

≥197

Fabrication Process


 

 

Advantage


The multilayer composite material CMC/CPC has excellent initial heat dissipation properties on its surface since both surfaces are made of copper. As a form of electronic packaging material, it shows a better heat dissipation effect than molybdenum-copper alloys. It has thus become the preferred heat sink packaging material for a new generation of high-power electrical appliances, and has broad application prospects.