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low coefficient of thermal expansion 6.5 ppm-°C Molybdenum Copper Electronic Packaging Materials

Time: 2025.12.24

Some information about low coefficient of thermal expansion 6.5 ppm-°C Molybdenum Copper Electronic Packaging Materials:

Type Molybdenum Series
Company Name ATTL Advanced Materials Co.,Ltd
Place of Origin Tianjin,China
Industry experience 60+years
Number of patents 130 +
Factory covers 386000 ㎡
Certificate ISO 45001:2018,ISO 50001:2018,ISO 9001:2015...
Product Features Wide selection,Corrosion resistance,High thermal conductivity,Ultra-high density...
Application aerospace,solar photovoltaics,consumer electronics,flat panel displays,new energy vehicles,nuclear,electronics and electricity,semiconductor equipment...etc
OEM and ODM Acceptatble
Number of employees 1600+
Color Light Silver,Gray,Silver...
Trading Country Mid east,South america,Southeast asia,Europe,Clipperton Island,Venezuela,Burkina Faso,Sierra Leone...
Packing Size 98 * 27 * 98 According to container size, standard export package
Sample Available
Nearby ports Tianjin,Qingdao...
Payment paypal,Western Union,L/C,T/T...etc
Material Composite Materials,Ceramics,Tungsten and Tungsten Alloy,Molybdenum and Molybdenum Alloy,Tantalum Niobium and Its Alloys...
Terms of delivery FOB,EXW,CIF...
R&D and manufacturing bases Tianjin Baodi Economic Development Zone,Shaanxi Baoji Taibai County Economic Park,Beijing Zhongguancun Innovation Park
Selling Units Single item
Package Plastic box + carton
After-sales Service Online support

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low coefficient of thermal expansion 6.5 ppm-°C Molybdenum Copper Electronic Packaging Materials

 

 

The production machinery and equipment for low coefficient of thermal expansion 6.5 ppm-°C Molybdenum Copper Electronic Packaging Materials

 

 

low coefficient of thermal expansion 6.5 ppm-°C Molybdenum Copper Electronic Packaging Materials

 

 

Some of our laboratory equipment for low coefficient of thermal expansion 6.5 ppm-°C Molybdenum Copper Electronic Packaging Materials

 

 

low coefficient of thermal expansion 6.5 ppm-°C Molybdenum Copper Electronic Packaging Materials

 

 

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low coefficient of thermal expansion 6.5 ppm-°C Molybdenum Copper Electronic Packaging Materials