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Low Coefficient of Thermal Expansion 8.2 ppm-°C Molybdenum Copper Electronic Packaging Materials
Time: 2025.12.24
Some information about Low Coefficient of Thermal Expansion 8.2 ppm-°C Molybdenum Copper Electronic Packaging Materials:
| Type | Molybdenum Series |
| Company Name | ATTL Advanced Materials Co.,Ltd |
| Place of Origin | China |
| Industry experience | 60+years |
| Number of patents | 130 + |
| Factory covers | 386000 ㎡ |
| Certificate | ISO 50001:2018,ISO 9001:2015,ISO 14001:2105... |
| Product Features | Wide selection,Softening resistance,Corrosion resistance,Good biocompatibility... |
| Application | quartz, glass and fiberglass manufacturing,large scale integrated circuits,automobiles,high-temperature industrial furnaces,equipment manufacturing,metal material processing,flat panel displays,consumer electronics...etc |
| OEM and ODM | Support |
| Number of employees | 1600+ |
| Color | Light Silver,Silver,Silver Gray... |
| Trading Country | North america,Africa,Europe,Southeast asia,Libya,Europa Island,Ireland,Gabon... |
| Packing Size | 82 * 28 * 87 According to container size, standard export package |
| Sample | Available |
| Nearby ports | Tianjin,Qingdao... |
| Payment | Western Union,T/T,paypal...etc |
| Material | Rhenium and Rhenium Alloy,Tungsten and Tungsten Alloy,Tantalum Niobium and Its Alloys,Composite Materials,Ceramics... |
| Terms of delivery | DDU,CFR,EXW,CIF... |
| R&D and manufacturing bases | Beijing Zhongguancun Innovation Park,Tianjin Baodi Economic Development Zone,Shaanxi Baoji Taibai County Economic Park,Shandong Weihai Industrial New Zone |
| Selling Units | Single item |
| Package | Plastic box + carton |
| After-sales Service | Online support |
Please note: The above table data is for reference only. For specific information, please contact us.
Our company
The production machinery and equipment for Low Coefficient of Thermal Expansion 8.2 ppm-°C Molybdenum Copper Electronic Packaging Materials
Some of our laboratory equipment for Low Coefficient of Thermal Expansion 8.2 ppm-°C Molybdenum Copper Electronic Packaging Materials
Our some certificates and patents
Address:Area C, AT&M, No. 10 North Yongcheng Road, Yongfeng Industrial Base, Haidian District, Beijing, China / No. 10 Baozhong Road, Baodi Economic and Development Zone, Tianjin, China
Tel: +86 (0)10 5871-7301 / +86 (0)22 5921-3388
International Trade: +86 18892203868 / anne@attl.cn
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ATTL Advanced Materials Co.,Ltd.