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low thermal expansion 8.3×10⁻⁶-K tungsten copper electronic packaging materials

Time: 2025.12.25

Some information about low thermal expansion 8.3×10⁻⁶-K tungsten copper electronic packaging materials:

Type Tungsten Series
Company Name ATTL
Place of Origin Tianjin,China
Industry experience 60+years
Number of patents 130 +
Factory covers 386000 ㎡
Certificate ISO 45001:2018,ISO 9001:2015,ISO 50001:2018...
Product Features Ultra-high density,Wide selection,Corrosion resistance,High thermal conductivity...
Application metal material processing,equipment manufacturing,large scale integrated circuits,quartz, glass and fiberglass manufacturing,solar photovoltaics,aerospace,high-temperature industrial furnaces,new energy vehicles...etc
OEM and ODM Support
Number of employees 1600+
Color Gray,Silver Gray,Black...
Trading Country Africa,Mid east,South america,Europe,Sudan,Latvia,Western Sahara...
Packing Size 88 * 26 * 96 According to container size, standard export package
Sample Available
Nearby ports Tianjin,Qingdao,Tangshan...
Payment T/T,Western Union,L/C,paypal...etc
Material Composite Materials,Ceramics,Molybdenum and Molybdenum Alloy,Rhenium and Rhenium Alloy,Tantalum Niobium and Its Alloys...
Terms of delivery CFR,DDU,EXW,FOB...
R&D and manufacturing bases Beijing Zhongguancun Innovation Park,Tianjin Baodi Economic Development Zone,Shaanxi Baoji Taibai County Economic Park,Shandong Weihai Industrial New Zone
Selling Units Single item
Package Plastic box + carton
After-sales Service Online support

Please note: The above table data is for reference only. For specific information, please contact us.

 

 

 

 

Our company

 

 

 

 

low thermal expansion 8.3×10⁻⁶-K tungsten copper electronic packaging materials

 

 

The production machinery and equipment for low thermal expansion 8.3×10⁻⁶-K tungsten copper electronic packaging materials

 

 

low thermal expansion 8.3×10⁻⁶-K tungsten copper electronic packaging materials

 

 

Some of our laboratory equipment for low thermal expansion 8.3×10⁻⁶-K tungsten copper electronic packaging materials

 

 

low thermal expansion 8.3×10⁻⁶-K tungsten copper electronic packaging materials

 

 

Our some certificates and patents

 

 

low thermal expansion 8.3×10⁻⁶-K tungsten copper electronic packaging materials