Product Series
Tungsten Copper Electronic Packaging Materials
Product Introduction
Tungsten-copper alloy contains 6-50% (by weight ratio) of copper, and offers the advantages of both tungsten and copper: high temperature resistance, arc ablation resistance, high strength, high specific gravity, excellent electrical and thermal conductivity, small thermal expansion, and easy cutting. Also, it has properties such as transpiration cooling. It is widely used in semiconductor industries such as electronic components and power devices.
Tungsten copper materials combine the low thermal expansion rate of tungsten with the high thermal conductivity of copper. They help effectively release heat from electronic devices and cool various products such as IGBT modules, RF power amplifiers, and LED chips. They can be used in large-scale integrated circuits and high-power microwave devices as insulated metal substrates, thermal control boards, heat dissipation elements (heat sink materials), and lead frames.
Product Application
● Electronic equipment cooling devices.
● High performance lead frames.
● Thermal control boards and radiators for thermal control devices.
● Microwave, laser, radio frequency, optical communication and other high-power devices.
Product Specifications
Chemical composition and physical and mechanical properties of tungsten-copper composite materials
|
Grade |
Chemical composition (weight %) |
Density |
Hardness |
Resistivity |
Conductivity |
Bending strength |
||
|
Cu |
Total Impurities |
W |
g/cm3 |
HB Kgf/mm2 |
μΩ.cm |
%IACS |
MPa |
|
|
WCu50 |
50±1 |
≤0.5 |
Margin |
≥11.85 |
≥115 |
≤3.2 |
≥54 |
-- |
|
WCu45 |
45±1 |
≤0.5 |
Margin |
≥12.30 |
≥125 |
≤3.5 |
≥49 |
-- |
|
WCu40 |
40±1 |
≤0.5 |
Margin |
≥12.75 |
≥140 |
≤3.7 |
≥47 |
-- |
|
WCu35 |
35±1 |
≤0.5 |
Margin |
≥13.30 |
≥155 |
≤3.9 |
≥44 |
-- |
|
WCu30 |
30±1 |
≤0.5 |
Margin |
≥13.80 |
≥175 |
≤4.1 |
≥42 |
≥790 |
|
WCu25 |
25±1 |
≤0.5 |
Margin |
≥14.50 |
≥195 |
≤4.5 |
≥38 |
≥885 |
|
WCu20 |
20±1 |
≤0.5 |
Margin |
≥15.15 |
≥220 |
≤5.0 |
≥34 |
≥980 |
|
WCu15 |
15±1 |
≤0.5 |
Margin |
≥15.90 |
≥240 |
≤5.7 |
≥30 |
≥1080 |
|
WCu10 |
10±1 |
≤0.5 |
Margin |
≥16.75 |
≥260 |
≤6.5 |
≥27 |
≥1160 |
Thermal properties of tungsten copper composite materials
|
Material composition (wt%) |
WCu10 |
WCu15 |
WCu20 |
WCu25 |
WCu30 |
|
Thermal conductivity (W/m·K) |
>170 |
>180 |
>190 |
>200 |
>210 |
|
Coefficient of thermal expansion(×10-6/K) |
6.2~6.8 |
6.9~7.5 |
7.5~8.0 |
8.0~8.6 |
8.7~9.4 |
Fabrication Process
Company Advantage
Providing tungsten copper bare chip and surface coating treatment processes such as Ni plating and Au plating.
Design based on customer's specified requirements to achieve high processing accuracy, good surface finish and flatness.
The product offers excellent air tightness, and has passed leak detection tests on a helium mass spectrometer at < 5*10-⁹Pa·m³/s.
Contact Information
Song Peng
+86-10-58717301
songpeng@atmcn.com
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We provide you with materials and design solutions according to your needs
Address:Area C, AT&M, No. 10 North Yongcheng Road, Yongfeng Industrial Base, Haidian District, Beijing, China / No. 10 Baozhong Road, Baodi Economic and Development Zone, Tianjin, China
Tel: +86 (0)10 5871-7301 / +86 (0)22 5921-3388
International Trade: +86 18892203868 / anne@attl.cn
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ATTL Advanced Materials Co.,Ltd.