Product Series
Molybdenum Copper Electronic Packaging Materials
Product Introduction
Molybdenum-copper alloy is a pseudo-alloy composed of two non-solid-melting metals, and features characteristics of both molybdenum and copper. It exhibits high thermal conductivity, a low adjustable thermal expansion coefficient, is non-magnetic, and features low gas content, excellent vacuum performance, high machinability, and good high temperature performance. Widely used in machinery, electric power, electronics, metallurgy and other industries.
Product Application
● Radio base stations
● High performance lead frames
● Heat sink for electronic equipment
● Heat dissipation material for power amplifiers
● Thermal control boards and radiators for thermal control devices
● Used in the IGBT modules of electric vehicle engines
Product Specifications
Molybdenum copper electronic packaging materials
|
Grade |
Molybdenum content Wt% |
Copper content Wt% |
Density g/cm3 |
Thermal conductivity W/(M.K) |
Coefficient of thermal expansion (10-6/K) |
|
Mo85Cu15 |
85± 1 |
Balance |
≥10 |
≥160 |
6.5-7.3 |
|
Mo80Cu20 |
80 ± 1 |
Balance |
≥9.9 |
≥170 |
7.0-7.7 |
|
Mo70Cu30 |
70 ± 1 |
Balance |
≥9.8 |
≥180 |
7.5-8.5 |
|
Mo60Cu40 |
60 ± 1 |
Balance |
≥9.66 |
≥210 |
8.5-9.5 |
|
Mo50Cu50 |
50 ±0.2 |
Balance |
≥9.54 |
≥230 |
10.0-11.5 |
Fabrication Process
Company Advantage
High thermal conductivity and low thermal expansion coefficient.
Design based on customer's specified requirements to achieve high processing accuracy, good surface finish and flatness.
The product features excellent air tightness and passes the helium mass spectrometer leak detection test <5*10-9Pa·m3/S.
Compared with tungsten copper alloys, molybdenum copper alloys feature low density and extremely low porosity. The specific surface measured by the BET method is half that of domestic counterparts (100 5*5*52mm samples were selected for comparison).
Contact Information
Song Peng
+86-10-58717301
songpeng@atmcn.com
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