Product Series
CMC/CMCC electronic packaging materials
Product Introduction
Copper-molybdenum-copper (CMC) and copper-molybdenum-copper-copper (CMCC) are forms of three-layer materials. The core material is molybdenum or molybdenum copper, with both sides covered with copper. By adjusting the composition of the Cu-Mo core material and the Cu lamination ratio, the thermal conductivity and thermal expansion coefficient of the material can be adjusted. Since the surface consists of copper, it offers an excellent initial heat dissipation performance.
Product Application
1. Multi-material electronic packaging materials provide a better alternative for high-power electronic components due to their lower thermal expansion coefficient and thermal conductivity, far superior to WCu and MoCu. They are used to help cool a variety of high-power components such as IGBT modules. Heat sinks, lead frames, expansion layers and heat transfer channels for multi-layer printed circuit boards (PCBs).
2. IGBT modules for electric vehicle engines.
3. High-power RF, microwave and semiconductor devices.
Product Specifications
Product Specifications: We can provide ply structure materials with various thicknesses and different layer structures to meet the various requirements of customers, as well as provide samples and material performance test data.
Performance table
| Raw material (name) |
Composition [wt%] |
Density [g/cm3] |
Coefficient of thermal expansion [10-6/K] |
Thermal conductivity [W/(m K)] |
|
CMCC141 |
Cu/MoCu30/Cu |
9.5±0.2 |
8.8-9.1 |
≥220 |
|
CMCC232 |
Cu/MoCu30/Cu |
9.3±0.2 |
10.2-10.9 |
≥255 |
|
CMCC111 |
Cu/MoCu30/Cu |
9.2±0.2 |
10.8-11.6 |
≥280 |
|
CMCC212 |
Cu/MoCu30/Cu |
9.1±0.2 |
11.5-12.1 |
≥300 |
|
CMC111 |
Cu/Mo/Cu |
9.3±0.2 |
9.9-10.4 |
≥230 |
|
S-CMC51515 |
Cu/Mo/Cu/Mo/Cu |
9.2±0.2 |
11.5-11.9 |
≥310 |
|
Oxygen-free copper TU1 |
Cu |
8.93 |
17.7 |
≥391 |
Fabrication Process
Company Advantage
60-year experience in refractory metal manufacturing.
Precision process control.
Complete quality inspection and measurement methods.
Production capacity is sufficient for the bulk demands of customers.
Contact Information
Song Peng
+86-10-58717301
songpeng@atmcn.com
Fill out the form and we will contact you
We provide you with materials and design solutions according to your needs
Address:Area C, AT&M, No. 10 North Yongcheng Road, Yongfeng Industrial Base, Haidian District, Beijing, China / No. 10 Baozhong Road, Baodi Economic and Development Zone, Tianjin, China
Tel: +86 (0)10 5871-7301 / +86 (0)22 5921-3388
International Trade: +86 18892203868 / anne@attl.cn
Scan and Subscribe to Learn More
ATTL Advanced Materials Co.,Ltd.