Product Series

AlSiC Electronic Packaging Materials

Product Introduction


Aluminum silicon carbide (AlSiC) combines the high thermal conductivity of metal with the low thermal expansion of ceramics, which meets the requirements of multifunctional properties and designs. The performance parameters of materials can be changed by adjusting components to achieve perfect performance matching between dissimilar materials.

 

Product Application


● Carrier boards for microwave devices in the aerospace field.。

● Cooling substrates on the IGBT modules of electric vehicles.

● Large phased array radar chip carriers.

Product Specifications


We provide customers with AlSIC materials of different shapes and compositions to meet their various usage requirements.

Typical heat sink material performance table

Grade Density Thermal expansion coefficient Thermal conductivity Bending strength
g/cm3 (10-6/K) W/M·K MPa
Al-55%SiC 2.95 9.0 170 >300
Al-60%SiC 2.97 8.3 150 >300
Al-65%SiC 2.99 8.1 140 >300

Fabrication Process


Company Advantage


Aluminum silicon carbide (AlSiC) is a third-generation electronic packaging material with a set of outstanding properties, including high thermal conductivity, low expansion, high stiffness, low density, and low cost.

Precision process control.

Complete quality inspection and measurement methods.

The world's leading pressure impregnation process and equipment technology.

Contact Information

SongPeng


+86-10-58717301


songpeng@atmcn.com


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We provide you with materials and design solutions according to your needs