Product Series

SiAl Electronic Packaging Materials

Product Introduction


Aluminum-silicon electronic packaging materials are binary alloys composed of aluminum and silicon. Their material density is between 2.3-4.7 g/cm³, while the coefficient of thermal expansion (CTE) is between 7-20ppm/℃. Increasing the silicon content can significantly reduce the density and thermal expansion coefficient of the alloy materials. They are a form of electronic packaging materials with broad application prospects.

 

Product Application


● Packaging boxes and covers in aerospace, space technology and other fields.

● Portable electronic devices.

Product Specifications


We provide customers with AlSi materials of different compositions to meet their various operating requirements.

 

CEAlloy
designation
Alloy
composition
CTE
ppm/℃,
25-100℃
Density
g/cm3
Thermal
Conductivity
at 25℃
W/m·K
Bend
Strength,
Mpa
Yield
Strength,
Mpa
Elastic
Modulus,
Gpa
CE20 Al- 12%Si 20.0 2.70        
CE17 Al -27%Si 16.0 2.60 177 210 183 92
CE17M Al -27%Si 16.0 2.60 147     92
CE13 A1-42%Si 12.8 2.55 160 213 155 107
CE11 Si - 50%Al 11.0 2.50 149 172 125 121
CE9 Si - 40%Al 9.0 2.45 129 140 134 124
CE7 Si - 30%Al 7.4 2.40 120 143 100 129

*CE17M also contains minor additions of Fe, Mg and Mn

Fabrication Process


Company Advantage


Superior properties such as low density, good thermal conductivity, high specific strength and stiffness, and easy precision machining.

Precision process control.

Complete quality inspection and measurement methods.

The world's leading hot isostatic pressing process technology and equipment technology.

Contact Information

SongPeng


+86-10-58717301


songpeng@atmcn.com


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We provide you with materials and design solutions according to your needs