Product Series
SiAl Electronic Packaging Materials
Product Introduction
Aluminum-silicon electronic packaging materials are binary alloys composed of aluminum and silicon. Their material density is between 2.3-4.7 g/cm³, while the coefficient of thermal expansion (CTE) is between 7-20ppm/℃. Increasing the silicon content can significantly reduce the density and thermal expansion coefficient of the alloy materials. They are a form of electronic packaging materials with broad application prospects.

Product Application
● Packaging boxes and covers in aerospace, space technology and other fields.
● Portable electronic devices.
Product Specifications
We provide customers with AlSi materials of different compositions to meet their various operating requirements.
| CEAlloy designation |
Alloy composition |
CTE ppm/℃, 25-100℃ |
Density g/cm3 |
Thermal Conductivity at 25℃ W/m·K |
Bend Strength, Mpa |
Yield Strength, Mpa |
Elastic Modulus, Gpa |
| CE20 | Al- 12%Si | 20.0 | 2.70 | ||||
| CE17 | Al -27%Si | 16.0 | 2.60 | 177 | 210 | 183 | 92 |
| CE17M | Al -27%Si | 16.0 | 2.60 | 147 | 92 | ||
| CE13 | A1-42%Si | 12.8 | 2.55 | 160 | 213 | 155 | 107 |
| CE11 | Si - 50%Al | 11.0 | 2.50 | 149 | 172 | 125 | 121 |
| CE9 | Si - 40%Al | 9.0 | 2.45 | 129 | 140 | 134 | 124 |
| CE7 | Si - 30%Al | 7.4 | 2.40 | 120 | 143 | 100 | 129 |
*CE17M also contains minor additions of Fe, Mg and Mn
Fabrication Process

Company Advantage
Superior properties such as low density, good thermal conductivity, high specific strength and stiffness, and easy precision machining.
Precision process control.
Complete quality inspection and measurement methods.
The world's leading hot isostatic pressing process technology and equipment technology.
Contact Information
SongPeng
+86-10-58717301
songpeng@atmcn.com
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We provide you with materials and design solutions according to your needs