Product Series

Ceramic Metal Packaging Shell

Product Introduction


The ceramic/metal packaging shell is an external structure used to protect integrated circuit multi-functional chips and micro-assembly circuits, as well as other internal functional components.

Product Application


● Microwave RF power devices

● Optical communication devices

● High power lasers

● Infrared detectors

Product Specifications


We can provide customers with customized structural designs to meet their requirements for operating frequency, air-tightness, insulation, and salt spray resistance.

Fabrication Process


Company Advantage


Complete tried-and-tested heat sink material production process.

Advanced HTCC ceramic production technology and batch equipment.

Advanced precision mold design and stress simulation analysis capabilities.

First-class domestic production lines for mounting, brazing and electroplating.

Contact Information

Song Peng


+86-10-58717301


songpeng@atmcn.com


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We provide you with materials and design solutions according to your needs