Product Series
Ceramic Metal Packaging Shell
Product Introduction
The ceramic/metal packaging shell is an external structure used to protect integrated circuit multi-functional chips and micro-assembly circuits, as well as other internal functional components.
Product Application
● Microwave RF power devices
● Optical communication devices
● High power lasers
● Infrared detectors
Product Specifications
We can provide customers with customized structural designs to meet their requirements for operating frequency, air-tightness, insulation, and salt spray resistance.
Fabrication Process
Company Advantage
Complete tried-and-tested heat sink material production process.
Advanced HTCC ceramic production technology and batch equipment.
Advanced precision mold design and stress simulation analysis capabilities.
First-class domestic production lines for mounting, brazing and electroplating.
Contact Information
Song Peng
+86-10-58717301
songpeng@atmcn.com
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We provide you with materials and design solutions according to your needs
Address:Area C, AT&M, No. 10 North Yongcheng Road, Yongfeng Industrial Base, Haidian District, Beijing, China / No. 10 Baozhong Road, Baodi Economic and Development Zone, Tianjin, China
Tel: +86 (0)10 5871-7301 / +86 (0)22 5921-3388
International Trade: +86 18892203868 / anne@attl.cn
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ATTL Advanced Materials Co.,Ltd.