Product Series
Oxygen-free Copper (OFC)
Product Introduction
OFC is pure copper that does not contain oxygen or any deoxidizer residue. Based on the product standards, the purity of copper is greater than 99.95%, the oxygen content is no greater than 0.003%, and the total impurity content is no greater than 0.05%.
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Typical OFC Materials Properties |
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Melting point |
Softening temperature |
Density g/cm³ Density at 20℃ |
Coefficient of thermal expansion at 20℃ |
Thermal conductivity at 25℃ |
|
1083℃ |
150℃ |
8.93 |
17.7*10-6/K |
391W/M·K |
Product Application
OFC heat sinks exhibit good thermal conductivity and electrical conductivity, and are mainly used in the electronics and laser industries. They can be used as heat sinks, shells and covers in electronic packaging modules.
Product Specifications
If processed according to the drawings, bare chips and various electroplated chips containing nickel/gold/silver can be provided.
Fabrication Process
Company Advantage
60-year experience in refractory metal manufacturing.
Precision process control.
Complete quality inspection and measurement methods.
A long history of copper processing, ISO and IATF16949 certification passed.
Contact Information
SongPeng
+86-10-58717301
songpeng@atmcn.com
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Address:Area C, AT&M, No. 10 North Yongcheng Road, Yongfeng Industrial Base, Haidian District, Beijing, China / No. 10 Baozhong Road, Baodi Economic and Development Zone, Tianjin, China
Tel: +86 (0)10 5871-7301 / +86 (0)22 5921-3388
International Trade: +86 18892203868 / anne@attl.cn
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ATTL Advanced Materials Co.,Ltd.