Application Field
5G
Field Introduction
With the high speed, large capacity and miniaturization of modern devices, the amount of heat generated by semiconductors used for wireless communication is also increasing. Various compound semiconductor GaN (gallium nitride) chips are installed on 5G base stations (antennae). Compared with traditional silicon semiconductors, they are small with high performance parameters. However, due to their high calorific density (calorific value per unit volume), efficient heat dissipation methods are indispensable to ensure the reliability of communication networks. ATTL provides a variety of high thermal conductivity and low expansion materials for GaN semiconductor power amplifiers, offering technical support for the new generation of mobile communication networks.
Advantages
■ An enterprise that combines research, development and production in the field of system-in-package technology.
■ We boast a complete packaging material product system, including metal material systems and ceramic material systems, with independent material design and testing evaluation methods. We have a complete micro-assembly production line, with the technical capabilities for ceramic and glass packaging.
Address:Area C, AT&M, No. 10 North Yongcheng Road, Yongfeng Industrial Base, Haidian District, Beijing, China / No. 10 Baozhong Road, Baodi Economic and Development Zone, Tianjin, China
Tel: +86 (0)10 5871-7301 / +86 (0)22 5921-3388
International Trade: +86 18892203868 / anne@attl.cn
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ATTL Advanced Materials Co.,Ltd.